SEQUANS Introduces Mobile WiMAX Single Chip Solution Integrating Baseband, RF, and Memory
May 19, 2008

Mitsumi first to use new SQN1170 in SDIO module with full Mobile WiMAX system functionality

MUNICH, WIMAX WORLD EUROPE – May 19, 2008 – Sequans Communications, leading WiMAX chipmaker, announced availability of its newest chip, the SQN1170, which integrates baseband, RF, and memory in a single chip.  Sequans also announced that Mitsumi, leading system-in-package module maker, is the first to use the chip to develop an SDIO module comprising full Mobile WiMAX system functionality. The SDIO module offers manufacturers a complete and highly flexible solution to quickly build high performance, low power-consuming Mobile WiMAX end user devices.  The SDIO module is the first of several modules Mitsumi is  developing based on Sequans’ SQN1170.  It will be on display at WiMAX World Europe, Sequans’ booth 411, May 20-21.

“We are very pleased to be working with Mitsumi,” said Georges Karam, Sequans CEO.  “The high level of integration, small size, and total Mobile WiMAX system functionality of the SDIO module make it one of the most valuable solutions for WiMAX device makers in the market today.”

“Sequans has proven itself to be the leading WiMAX chipmaker with singular achievements in performance and power consumption,” said Susumu Kuribayashi, senior manager, Mitsumi Electric Co.  “Our collaboration has yielded a superior module that will enable the manufacture of state-of-the-art Mobile WiMAX devices.”

The SQN1170 measures 12X12 mm2 and delivers high throughput of more than 30 Mbps with very low power, consuming less than 600 mW total power in peak MIMO mode.  The Mitsumi SDIO module measures a mere 400 mm2, integrating with the SQN1170 all components necessary to deliver full Mobile WiMAX system functionality.

The SQN1170 can be used to build all types of mobile devices–from mobile phones to embedded PC applications to SDIO modules for consumer electronics devices.  It also easily enables integrated combination designs such as WiFi/WiMAX half MiniCards with standard PCB and assembly technologies.

The SQN1170 is the sixth Mobile WiMAX chip Sequans has delivered, following a Mobile WiMAX Wave 1 chip in 2006, two baseband Mobile WiMAX Wave 2 chips in 2007 for base station and mobile stations and two RF chips (2.5 GHz and 3.5 GHz).

“The SQN1170 represents the latest significant step in Sequans’ product evolution strategy,” said Karam.

About Mitsumi
MITSUMI is constantly growing as a comprehensive manufacturer of electronics parts, and for many years has been instrumental in advancing the world’s electronics capabilities. Based on the concepts of “friendship, reliability, and creativity,” Mitsumi develops and manufactures a wide range of electronics parts, from discrete parts to units, by utilizing the full range of advanced technology at Mitsumi’s command. As a company that is helping to create the future, Mitsumi will continue to meet new challenges as we approach the 21st century.

Press contact:  Keiichi Otani, +1-408-660-5255,

About Sequans
SEQUANS Communications is the leading supplier of subscriber station and base station chips for both fixed and mobile WiMAX, based on IEEE 802.16-2004 and 802.16e-2005 standards. Sequans has products that are WiMAX Forum Certified™ for both Fixed and Mobile WiMAX, for both base station and subscriber station technology, and is the first and only WiMAX chipmaker to achieve this distinction. Sequans offers equipment manufacturers the most complete and powerful semiconductor solutions available today, enabling them to build the widest range of high performing WiMAX network components: femto, pico, micro and multi-sector macro base stations, outdoor and indoor subscriber terminals, home gateways, and all types of mobile devices.

Press contact:  Kimberly Tassin, 206.654.1001,

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