Sequans Conducts TD-LTE Demonstration at Mobile Asia Congress
November 17, 2010

HONG KONG, November 17, 2010 ― 4G chipmaker Sequans Communications is collaborating with China Mobile for a TD-LTE technology demonstration at Mobile Asia Congress. The demonstration will feature Sequans-powered USB TD-LTE USB dongles, along with other devices, all working in the same network and delivering very high throughput services, including high definition video.

“TD-LTE is an important new technology and we are pleased about the progress we have made in advancing it, as our technology demonstrations indicate,” said Georges Karam, Sequans CEO. “We are working with key TD-LTE ecosystem players and focusing intently on accelerating the availability of TD-LTE technology around the world.”

Sequans has been developing TD-LTE technology since 2009 and announced the availability of its first LTE chip in March of 2010. Sequans’ TD-LTE chips and USB dongles were used for the world’s first TD-LTE demonstration network, launched by China Mobile at the World Expo in Shanghai in May of this year.

The demonstration will run at Mobile Asia Congress in the stand of China Mobile, stand B01, November 17-18, at the Hong Kong Convention and Exhibition Centre. Sequans is located at stand D01.

About Sequans Communications
Sequans Communications is a 4G chipmaker, supplying LTE and WiMAX chips to equipment manufacturers and mobile operators worldwide. Founded in 2004 to address the WiMAX opportunity where it is now a global leader, Sequans expanded in early 2009 to address the LTE market. Sequans chips are inside leading WiMAX networks worldwide and will soon be inside LTE networks. www.sequans.com.

Press contacts: Kimberly Tassin for Sequans, +1.425.736.0569, Kimberly@sequans.com

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