All-in-One System-in-Package for Ultra Compact LTE-M and NB-IoT Devices

Monarch SiP, SQN66430, is a system-in-package (SiP) LTE-M/NB-IOT solution from Skyworks Solutions Inc. and Sequans for the design of wearables and other space-constrained LTE device types. It combines Skyworks’ LTE universal, multi-band RF front-end module, SKY68001 , with Sequans’ Monarch LTE-M/NB-IoT Platform, SQN3330, in a new, ultra compact SiP that enables worldwide deployment and roaming capability in a Single-SKU™ based on Sequans’ SAW-less radio design architecture. It complies with the ultralow-power and reduced complexity feature requirements of the 3GPP release 13 and 14 LTE-Advanced Pro standard that defines narrowband, low data rate LTE technology for machine-type-communications (MTC). Monarch SiP achieves a very high level of integration whereby baseband, RF transceiver, power management, RF front-end, RAM memory, and most of the required passives, are integrated into a 8.8 x 10.8 x 0.95 mm package for an industry-leading compact size. Monarch SiP runs Sequans’ carrier-proven LTE protocol stack, an OMA lightweight M2M (LWM2M) client for over-the-air device management, Sequans’ Cloud Connector™ and a rich set of AT commands.

Applications
Monarch SiP is ideal for adding LTE-M and/or NB-IoT connectivity to low data rate consumer and IoT devices, including health, safety, and fitness wearables, smart watches, and trackers of all types.

Highlights

  • Certified by Verizon Wireless
  • 3GPP Release 13 LTEAdvanced Pro; upgradable to Release 14
  • Supports narrowband LTE UE categories M1 and NB1/NB2
    – M1: 300 kbps DL / 375 kbps UL
    – NB1: 27 kbps DL / 63 kbps UL
    – NB2: 120 Kbps DL / 170 kbps UL
  • Extended DRX and PSM features for long sleep duration use cases
  • Proprietary Dynamic Power Management (DPM) technology for 10 years
    operation
  • Coverage enhancement methods
  • Programmable RF filtering for global band support in a Single SKU™ design
  • Supports VoLTE
  • Single chip 8.8 x 10.8 x 0.95 mm package
  • Extremely reduced BOM
  • Optimized for half-duplex FDD (HD-FDD) operation
  • 23dBm power class, with reduced power class option
  • Low power serial interfaces

 

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