SIMCom Wireless Solutions Selects Sequans for Suite of LTE for IoT Modules

By December 19, 2016 No Comments

PARIS, France and SHANGHAI, China – December 19, 2016 – LTE for IoT chipmaker Sequans Communications S.A. (NYSE: SQNS) announced that SIMCom Wireless, global leading machine-to-machine (M2M) wireless modules and solutions supplier, has adopted Sequans’ LTE chip technology for a suite of M2M and IoT modules. SIMCom will use Sequans’ LTE Cat 1 Platform, Calliope, and its newest LTE Cat M1/NB1 platform, Monarch, for a suite of module solutions. The first module to be introduced by SIMCom under the agreement is an LTE Cat 1 module, SIM7700V, based on Sequans’ Calliope LTE Cat 1 platform.  It supports Verizon’s LTE bands 4 and 13 and supports VoLTE.

“We selected Sequans because they are a leader in LTE for IoT and because their chips have been proven in the field with operators around the world,” said Wendy Wang, General Manager, SIMCom. “SIM7700V, our first Sequans-powered module, based on Sequans’ Calliope platform is available now. We believe that the new model will increase our market share in the North American market.”

Sequans’ Calliope LTE Cat 1 platform, compliant with Release 10/11 of the LTE standard, is for higher throughput IoT applications such as connected car and retail applications or applications requiring VoLTE capability. Calliope is certified by Verizon Wireless, AT&T, NTT DoCoMo, and T-Mobile US. Sequans’ Monarch LTE Cat M1/NB1 platform, compliant with Release 13 of the LTE standard, is for new narrowband applications such as wearables, asset trackers, and industrial sensors.

“SIMCom has an excellent reputation as an IoT and M2M solutions provider around the world and they have truly global market reach,” said Craig Miller, VP of worldwide marketing for Sequans. “SIMCom products have been deployed worldwide and certified by more than 100 agencies and operators, and we are pleased to provide our LTE chip technology to SIMCom.”

The SIM7700V LTE Cat 1 module supports LTE bands 4 and 13, is approximately 21 x 20 x 1.5mm in size, and is provided in a surface-mount LGA footprint.

Forward looking statements

 

About SIMCom Wireless

SIMCom Wireless Solutions is global leading Machine-to-Machine (M2M) wireless modules and solutions supplier, Since becoming established in 2002, SIMCom Wireless Solutions has been providing a variety of wireless technology platform modules and terminal level solutions around the world based on  GSM/GPRS/EDGE, WCDMA/HSPA/HSPA+, CDMA 1xRTT/EV-DO, FDD/TDD-LTE cellular communication and GPS/GLONASS/BEIDOU satellite positioning technology. According to a recent M2M report issued by market research firm ABI Research in US, SIMCom ranked number one in M2M module shipments in 2015. www.simcomm2m.com/En/

 

SIMCom contact:

Austin Li (China), +86 2132523040, lib@sim.com

 

About Sequans Communications

Sequans Communications S.A. (NYSE: SQNS) is a leading provider of single-mode 4G LTE semiconductor solutions for the Internet of Things (IoT) and a wide range of broadband data devices. Founded in 2003, Sequans has developed and delivered seven generations of 4G technology and its chips are certified and shipping in 4G networks around the world. Today, Sequans offers two LTE product lines: StreamrichLTE™, optimized for feature-rich mobile computing and home/portable router devices, and StreamliteLTE™, optimized for M2M devices and other connected devices for the IoT.  Sequans is based in Paris, France with additional offices in the United States, United Kingdom, Israel, Hong Kong, Singapore, Sweden, Taiwan, South Korea, and China. Visit Sequans online at www.sequans.comwww.facebook.com/sequanswww.twitter.com/sequans

 

Sequans contacts:

Media relations: Kimberly Tassin (USA), +1.425.736.0569, kimberly@sequans.com

Investor relations: Claudia Gatlin (USA), +1 212.830.9080, claudia@sequans.com.

 

SOURCE: Sequans Communications S.A.

 

© 2017 SEQUANS.